http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103924268-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D311-84 |
| filingDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103924268-B |
| titleOfInvention | A kind of application of sour copper leveling agent |
| abstract | The invention discloses a kind of application of sour copper leveling agent, the molecular structural formula of described sour copper leveling agent isn wherein, negatively charged ion X=Cln - or Brn - ; Rn 1 =O or S or N; Rn 2 , Rn 3 , Rn 4 =H, alkyl, thiazolinyl, aralkyl, heteroaralkyl, substituted alkyl, substituted alkenyl, substituted aralkyl or the one replaced in heteroaralkyl; Described sour copper leveling agent is applied in the plating of adjustable surface topography wafer.The present invention is on the basis of dye-type leveling agent different from the past, design and develop a kind of better water-soluble, colourless nontoxic, eco-friendly novel sour copper leveling agent molecule, by have the molecule of leveling effect composite with traditional leveling agent or other, as the compound leveling agent in sour copper plating, achieve under same chemical system, by the allotment to compound leveling agent molecular conecentration ratio, achieve effective control of copper plate surface pattern, the demand of different process can be met. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104725383-B |
| priorityDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.