http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103922274-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
filingDate | 2014-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2016-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-103922274-B |
titleOfInvention | A kind of preparation method of three-dimensional infrared light supply |
abstract | The invention provides a kind of three-dimensional infrared light supply and preparation method thereof, a silicon chip is provided; Silicon oxide film is formed at the positive and negative of this silicon chip; At front definition array window along array window etching oxidation silicon to exposing silicon face; Silicon groove array is formed along array window etch silicon surface; Remove the silica of the non-etch areas of front side of silicon wafer and form composite membrane; Form the resistance wire covering silicon groove array, form passivation layer on resistance wire surface; The window of silicon groove array is surrounded in the definition of this silicon chip back side; Along the silica of opening etch silicon chip back side to exposing silicon face; Corrosion silicon face is continued until silicon is corroded completely thus prepares three-dimensional infrared light supply structure along window.The present invention adopts resistance wire to be arranged in groove array, decreases the heat transfer of heating wire by substrate, reduces the heat dissipation that air thermal convection current causes, achieves the effect of energy accumulating, while reducing power consumption, improves energy conversion efficiency. |
priorityDate | 2014-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.