http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103917043-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate | 2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103917043-B |
| titleOfInvention | Patterned multi-insulating-material circuit substrate |
| abstract | The invention relates to a patterned multi-insulating-material circuit substrate and belongs to the technical field of printed circuit boards of semiconductor devices. The circuit substrate comprises a metal substrate, wherein a resin insulating layer and a high-heat-conduction insulating layer are formed on the metal substrate, the high-heat-conduction insulating layer serves as a base of a semiconductor component, and the resin insulating layer serves as a base of other electronic components. According to the patterned multi-insulating-material circuit substrate, the heat dissipation performance is remarkably improved, high reliability is achieved, the circuit substrate can be applied to various substrates containing semiconductor chips, for instance, heat dissipation of a CPU and the like in a computer circuit can be improved, heat dissipation of IGBTs and bipolar semiconductor chips in an inverter circuit can be improved, heat dissipation of wireless modules and the like in a wireless communication circuit can be improved, and heat dissipation of management chips in a power source management circuit can be improved. |
| priorityDate | 2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.