| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L35-06 |
| filingDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103881299-B |
| titleOfInvention |
Non-halogen resin composition and application thereof |
| abstract |
The invention provides a kind of non-halogen resin composition, it comprises: the epoxy resin of (A) 100 weight portion；(B) styrene maleic anhydride copolymer of 10 to 100 weight portions；And the bisphenol S of (C) 5 to 50 weight portion.The present invention is by comprising specific composition part and ratio, thus can reach high glass transition temperature, high-fire resistance and good appearance；Semi-solid preparation film or resin molding can be fabricated to, and then reach can be applicable to the purpose of copper clad laminate and printed circuit board (PCB). |
| priorityDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |