http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103849876-B

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Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06
filingDate 2012-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103849876-B
titleOfInvention A kind of chemically polishing method
abstract The invention provides a kind of chemically polishing method, copper or copper alloy are first placed in oxidation solution and are oxidized by the method, then the copper alloy after the copper after oxidation or oxidation is placed in light-emitting solution and processes.With prior art " three acid " technique and adopts compared with hydrogen peroxide Series Polishing Liquid, chemical polishing process is divided into two steps by the present invention, first in the surface formation zone of oxidation of copper or copper alloy, then carries out optical processing.First, do not contain nitric acid in oxidation solution and light-emitting solution, a large amount of tobacco contaminate environment can not be produced, also reduce the harm to operator ' s health; Secondly, polishing process is divided into oxidation and bright dipping two step, oxide compound is more soluble in sulfuric acid, adds the time of bright dipping service platform simultaneously, can avoid, in polishing process, bumping occurs, reduce the danger of reaction; Again, with the addition of alcohol compound in oxidation solution is stablizer, enhances the stability of superoxide, and oxidation solution is extended work-ing life.
priorityDate 2012-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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