| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03K2017-9602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03K17-962
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K17-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K17-975
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00 |
| filingDate |
2012-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103827977-B |
| titleOfInvention |
Thermoformable polymer thick film silver conductors and their use in capacitive switching circuits |
| abstract |
This invention relates to polymer thick film conductive compositions. More specifically, the polymer thick film conductive composition may be used in applications where bottom substrate thermoforming is used, such as in capacitive switches. Polycarbonate substrates are often used as the substrate, and the polymer thick film conductive composition can be used without any barrier layer. Thermoformable circuits benefit from the presence of an encapsulant layer on the dry polymer thick film conductive composition. |
| priorityDate |
2011-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |