http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103805127-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e5e19fe14a92e3541e055af06c9f5d3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04 |
| filingDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfb16c8c7969e130a68a7210c72f537 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b11b0cfb12a802d35de41393c01c4c02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37b3e74889a5e456fc228dc4d56f9930 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc01d9feba7e6ce168b03fe7f2af2b0b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06af4c4545f036b5e4d487cb9725bf59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_722d37166710cf8222120e974d7cca61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a95081c9b99d3a715196f992a76bdb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d6bb926c6fd73cb0be92ba018078bcd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_424f387f221115116737967742d93f0a |
| publicationDate | 2015-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103805127-B |
| titleOfInvention | Preparation method for high-temperature-resisting epoxy organic silicon pouring sealant |
| abstract | The invention provides a preparation method of a high-temperature-resisting epoxy organic silicon pouring sealant, relates to a preparation method of one pouring sealant, and aims to solve the problems that an existing pouring sealant cannot have good toughness, high heat resistance and good adhesion at the same time. The high-temperature-resisting epoxy organic silicon pouring sealant is prepared from epoxy organic silicon resin, active organic silicon fillers, a curing agent, a curing accelerator, a diluting agent and a de-foaming agent. The preparation method comprises the following steps: 1, preparing the epoxy organic silicon resin; 2, preparing the active organic silicon fillers; 3, weighing; and 4, mixing. According to the preparation method of the high-temperature-resisting epoxy organic silicon pouring sealant, the prepared epoxy organic silicon resin and the prepared active organic silicon fillers are used as raw materials and the prepared organic silicon pouring sealant has low adhesiveness and good wettability; and the cured product has toughness and heat resistance, and the quality of a pouring sealing piece is stable. According to the preparation method, the high-temperature-resisting epoxy organic silicon pouring sealant can be obtained. |
| priorityDate | 2014-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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