http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103803715-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_778fe5aa551806ca134b210927ef0eb8
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C02F5-08
filingDate 2012-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35f49899266748ea9eecd04ea75b5b54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96c2a9e7c02d6e6d81c265b5b5e7ba46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf881e47e13cf74f13da8db7fa05d0a4
publicationDate 2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103803715-A
titleOfInvention Method used for processing waste liquid of copper/copper barrier layer polishing solution
abstract The invention discloses a method used for processing waste liquid of a copper/copper barrier layer polishing solution. According to the method, a chemical solution containing an oxidizing agent is used for removing gel and copper ions in the waste liquid of the copper/copper barrier layer chemical mechanical polishing solution. The method is capable of avoiding blocking of pipelines by the waste liquid of the copper/copper barrier layer chemical mechanical polishing solution, and reducing environmental pollution caused by copper ions.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112175525-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106794397-A
priorityDate 2012-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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