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filingDate 2005-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103794582-B
titleOfInvention Semiconductor device
abstract A semiconductor device comprising at least one semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip, and a heat radiation surface for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat sink sealing parts. The radiant surface is cooled by a cryogen. An opening is formed in a portion of the sealing member that is a refrigerant passage through which refrigerant flows.
priorityDate 2004-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.