| abstract |
The present invention provides a power module, which includes: a sealing body that seals a conductor plate on which a semiconductor chip is mounted with a resin such that a heat dissipation surface of the conductor plate is exposed; a heat dissipation member disposed so as to face the heat dissipation surface; The insulating layer is arranged between the sealing body and the heat dissipation member, and the insulating layer has: a laminated body, which is laminated with a ceramic sprayed film impregnated with an impregnating resin and an adhesive resin layer mixed with a filler having good thermal conductivity, so as to be compatible with the The heat dissipation member is provided so as to be in contact with at least the entire area of the heat dissipation surface, and the stress relaxation resin portion is provided in the gap between the heat dissipation member and the sealing body so as to cover the entire edge of the end portion of the laminate. |