http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103741125-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e1c660179935c4cddcbbda6d455b71d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
filingDate 2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42451a15049123b622f11aabcebb9b1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4e6a8a3485951b008b6c3a50016507a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a88d5261c682df75f52a5ed90861538e
publicationDate 2015-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103741125-B
titleOfInvention Selective surface metallization method of polymer base material and polymer base material with metallized pattern on surface obtained by method
abstract The invention provides a selective surface metallization method of a polymer base material, which comprises the steps of irradiating the surface, on which a pattern is required to be formed, of the polymer base material with an energy bundle, and performing chemical plating on the irradiated polymer base material, wherein the polymer base material is formed by a mixture; the mixture comprises a polymer as a matrix component, and at least one metal compound dispersed in the polymer; at least a part of main chains of the polymer comprise ester groups and/or amide groups; an irradiation condition of the energy bundle allows a contact angle between the irradiated surface of the polymer base material and water to be more than 120 degrees; and the metal compound is selected from a compound shown as Formula I ((CuaM<1>1-a)3(PO4)2), a compound shown as Formula II ((CubM<2>1-b)2(OH)PO4) and a compound shown as Formula III ((CucM<3>1-c)2P2O7). With the adoption of the method for selective metallization of the surface of the polymer base material, the chemical plating speed is high, and a formed metal coating has high adhesion to the polymer base material.
priorityDate 2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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