http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103725390-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10N30-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10N40-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M173-00 |
| filingDate | 2013-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103725390-B |
| titleOfInvention | A kind of silicon chip Linear cut water-base cutting fluid and preparation method thereof |
| abstract | A kind of silicon chip Linear cut water-base cutting fluid, is made up of the raw material of following weight part: sodium napthionate 2-3, polyoxyethylene nonylphenol ether 2-3, oleic acid diethanolamine 1-2, glycerin fatty acid ester 4-5, sodium laurylsulfate 1-2, mineral oil 15-18, petroleum sodium sulfonate 2-3, oleic acid 1-2, auxiliary agent 6-8, water 200; The surface tension of cutting fluid of the present invention is low, greatly improves cutting fluid to the wettability of abrasive material, improves the dispersiveness of abrasive material, avoid Abrasive agglomerate to form block and bring damage to silicon chip; Cooling and Lubricator performance is good, and working accuracy is high, is conducive to the yield rate improving silicon chip cutting, makes silicon chip cut yield rate and reaches 98%, and line of cut long service life; Corrosion-free and protective membrane can be formed at silicon chip surface to silicon chip, silicon chip is more easily cleaned. |
| priorityDate | 2013-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.