http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103700619-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1068 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2013-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103700619-B |
| titleOfInvention | Copper-connection is electroplated fill method |
| abstract | The present invention relates to a kind of copper-connection and electroplate fill method, comprise the following steps: using the copper plating bath of filling for hole as electrolyte, put into three-electrode system, measure its electrochemistry curve; Determine current peak and magnitude of voltage corresponding to electric current paddy difference according to electrochemistry curve; The sample with pore structure is put into three-electrode system as working electrode, make the voltage of hole surface corresponding to voltage corresponding to electric current paddy on electrochemistry curve, after energising, take out; The thickness of copper is filled in measured hole cross section everywhere, and its thickness is corresponding to the position of current peak on electrochemistry curve; Adjust the concentration of copper plating bath, change the position of current peak and electric current paddy on its electrochemistry curve, make the voltage of hole surface in electro-coppering process corresponding to voltage corresponding to electric current paddy on electrochemistry curve, the voltage at the bottom of hole is corresponding to voltage corresponding to current peak on electrochemistry curve. The present invention can realize flawless perfect filling of copper facing, and easy and simple to handle, can be widely used in various high-end electronic manufacturing fields. |
| priorityDate | 2013-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.