http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103687921-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-06 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate | 2012-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103687921-B |
| titleOfInvention | Comprise the hot-melt adhesive of poly-(methyl) acrylate of radiation-cross-linkable and oligomeric (methyl) acrylate containing non-vinylformic acid C-C double bond |
| abstract | The present invention relates to a kind of hot-melt adhesive of radiation-cross-linkable, it comprises poly-(methyl) acrylate of at least one, its radiation-cross-linkable and being formed by (methyl) vinylformic acid C1-C10 alkyl ester of at least 60 % by weight; And at least one oligomeric (methyl) acrylate, its contain non-vinylformic acid C-C double bond and K value less than or equal to 20.Described hot-melt adhesive comprises a kind of light trigger, this light trigger be not connected to poly-(methyl) acrylate and/or be not connected to oligomeric (first) acrylate additive form exist, and poly-(methyl) acrylate can be polymerized to, and/or oligomeric (methyl) acrylate can be connected to.Described hot-melt adhesive may be used for preparing self adhesive tape. |
| priorityDate | 2011-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.