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filingDate 2013-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103681355-B
titleOfInvention Prepare the method for accurate SOI source-drain field effect transistor device
abstract The present invention discloses a kind of method preparing accurate SOI source-drain field effect transistor device, comprises the steps: the active area forming device; Form the rhythmic structure of the fence of device; Form the doping of source and drain extension area, and form ground floor side wall in gate stack both sides; Form the source-drain structure of depression; Form accurate SOI source and drain separator; In-situ doped extension second semi-conducting material source and drain, and carry out annealing activation; False grid before then removing according to rear grid technique, re-start the deposit of high-k/metal gate; Form contact and metal interconnection.The method of the invention can be compatible with existing CMOS technology well, have the advantages that technique is simple, heat budget is less, compare traditional field-effect transistor, the accurate SOI source-drain field effect transistor device prepared according to the method for the invention effectively can reduce leakage current, reduces the power consumption of device.
priorityDate 2013-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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