http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103681352-A

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filingDate 2013-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e14e5be18664ac20b58800fcc22111ea
publicationDate 2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103681352-A
titleOfInvention Method for manufacturing a semiconductor device
abstract The invention refers to a method for manufacturing a semiconductor device. The improvement of the reliability of a semiconductor device having a split gate type MONOS memory is implemented. An ONO film and a second polysilicon film are sequentially formed so as to fill between a first polysilicon film and a dummy gate electrode. Then, the dummy gate electrode is removed. Then, the top surfaces of the first and second polysilicon films are polished, thereby forming a memory gate electrode formed of the second polysilicon film at the sidewall of a control gate electrode formed of the first polysilicon film via the ONO film. As a result, the memory gate electrode high in perpendicularity of the sidewall, and uniform in film thickness is formed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105977254-B
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priorityDate 2012-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 34.