http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103668095-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-35 |
| filingDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103668095-B |
| titleOfInvention | A kind of high power pulse plasma enhancing combined magnetic-controlled sputter deposition apparatus and using method thereof |
| abstract | The present invention relates to thin-film material technical field, particularly relate to a kind of high power pulse plasma enhancing combined magnetic-controlled sputter deposition apparatus, comprise vacuum chamber, magnetic controlling target, work rest and rotary support, magnetic controlling target comprises high-power impulse magnetron sputtering target and pulsed dc magnetron target, be fixed in vacuum chamber, arrange in 90 degree of subtends, its magnetic field layout type is contrary, forms closed field; The magnetic field layout type of each magnetic controlling target is unbalanced magnetic field.The present invention, by the embodiment of above structure, has good Distribution of Magnetic Field and ion plating effect, conveniently can deposit that membranous layer binding force is good, coating is fine and close, mechanical property is good, the high-quality coating of chemical composition controllable precise is for high speed cutting tool. |
| priorityDate | 2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 12.