| abstract |
The present invention relates to a kind of glue liquid for copper clad foil substrate, by weight, the composition of raw materials of described glue liquid is: bimaleimide resin 100 parts, allylic cpd 30 ~ 100 parts, fire retardant 5～60 parts, curing catalyst 0 ~ 6 part, mineral filler 0 ~ 30 part, solvent 10 ~ 80 parts. The present invention also provides the preparation method of a kind of glue liquid for copper clad foil substrate. The present invention can make copper clad foil substrate flame retardant resistance reach V0 level. Meanwhile, the second-order transition temperature of copper clad foil substrate can reach more than 260 DEG C, and thermotolerance can reach more than 300 seconds, while ensureing VO level flame retardant resistance, has more excellent resistance toheat. It is lower that the present invention also has raw materials cost, be easy to processing, environmental protection, without advantages such as toxic gas releases. |