http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103619131-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| filingDate | 2013-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103619131-B |
| titleOfInvention | A kind of circuit board producing method of anti-golden finger leakage copper |
| abstract | The present invention provides the circuit board producing method of a kind of anti-golden finger leakage copper, it is characterised in that: its OSP operation comprises following process: remove the spot of residual on wiring board；The copper face of circuit on microetch wiring board；Organic oxidation-resistant film is coated on copper face；On described microetch wiring board, the copper face of circuit refers to be immersed in micro-corrosion liquid wiring board and makes its copper face with 30 60 μ " speed of/min is etched 80 100 μ ".The present invention is by microetch operation, microetch liquid medicine and the optimization of gold-plated process, nickel plating process etc., effectively prevent the generation of golden finger leakage copper phenomenon common in wiring board production process, guarantee obtained wiring board quality, compare in prior art use insulating materials block golden finger prevent its leakage copper way, the present invention have easy and simple to handle, efficiency is more high makes progress, and is particularly suitable for industrialization promotion on a large scale. |
| priorityDate | 2013-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.