http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103605266-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate | 2007-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103605266-B |
| titleOfInvention | Photoresist residue and polymer residue remove liquid composition |
| abstract | The present invention provides a kind of photoresist residue and polymer residue removal liquid composition and use the method for removal liquid composition removal residue, the removal liquid composition can remove the photoresist residue and polymer residue generated in semiconductor circuit components manufacturing process in low temperature, in the short time.Composition of the invention, the photoresist residue and/or polymer residue generated in the process for the semiconductor circuit components that manufacture has metal line can be removed, its mass percentage for containing fluoride is 0.5%-3.0%, the mass percentage of water is no more than 30%, and pH value is below 4. |
| priorityDate | 2006-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.