| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1319
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-37001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103579150-B |
| titleOfInvention |
Solder projection for BGA |
| abstract |
The present invention relates to a kind of solder projection for BGA (BGA).A kind of solder tappet structure for BGA includes: at least one under-bump metallization (UBM) layer；And solder projection, it is formed at above at least one UBM layer.Solder projection has bump width and bump height, and the ratio of bump height and bump width is less than 1. |
| priorityDate |
2012-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |