http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103571418-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_107f7c426464fccee867325a84c5fb1b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
filingDate 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44529e6ce201a7f7c2dce9a57089a835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d7c1888010efa41ce59f23ba8bc71e
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publicationDate 2014-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103571418-B
titleOfInvention Flexible underfill and preparation method thereof
abstract The invention discloses a flexible underfill which is characterized by being prepared from the following raw materials in parts by weight: 40-50 parts of flexible epoxy resin, 1-10 parts of reactive diluent, 30-50 parts of curing agent, 1-10 parts of curing accelerant, 0.1-1 part of stabilizing agent and 0.1-1 part of coupling agent. Meanwhile, the invention provides a preparation method of the underfill. Compared with the prior art, the flexible underfill has better flexibility, easy to repair, has excellent adhesive property and is capable of effectively absorbing and reducing stress generated by a flip chip along with the changes of machines and temperature, so that the shock resistance of an electronic product is improved.
priorityDate 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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