http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103571204-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04
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filingDate 2012-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbaa32ced8e9cde96e22c835d25c6571
publicationDate 2014-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103571204-A
titleOfInvention Heat-conducting silicone grease composition for LED (light-emitting diode) illumination lamp and preparation method for same
abstract The invention discloses a heat-conducting silicone grease composition for an LED (light-emitting diode) illumination lamp and a preparation method for the same. The heat-conducting silicone grease composition for the LED illumination lamp is formed by compounding the following constituents in parts by weight: 30-40 parts of methyl phenyl vinyl silicone rubber, 10-20 parts of dimethyl silicon oil, 60-70 parts of a heat-conducting filler, 3-5 parts of dicumyl peroxide and a coupling agent, wherein the dosage of the coupling agent is 0.5-2% of the weight of the heat-conducting filler, and the heat-conducting filler is the mixture of silicon carbide, nickel powder and boron nitride; further, the heat-conducting filler is composed of the following constituents in parts by weight: 10-20 parts of isopropyl diacetoxystearate, 30-40 parts of tri(dioctylpyrophosphato) titanate, and 30-40 parts of triisostearoyl isopropyl titanate. The heat-conducting silicone grease composition for the LED illumination lamp disclosed by the invention is in effective contact with a heating assembly and a heat dissipation assembly so as to reduce contact thermal resistance between the heating assembly and the heat dissipation assembly, and has a high heat conductivity coefficient.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106810869-B
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type http://data.epo.org/linked-data/def/patent/Publication

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