http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103548135-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K2102-3026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-87 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2012-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103548135-B |
| titleOfInvention | Heat dissipation substrate and components using it |
| abstract | The main object of the present invention is to provide a heat dissipation substrate with excellent heat dissipation and no peeling or short circuit. The present invention achieves the above object by providing a heat dissipation substrate characterized in that it has a supporting base material, an insulating layer formed directly on the supporting base material, and a wiring layer formed directly on the insulating layer, Wherein, the insulating layer includes non-thermoplastic polyimide resin, and the thickness of the insulating layer is in the range of 1 μm˜20 μm. |
| priorityDate | 2011-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 158.