http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103540192-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_226fa86f9790e799a44846e2f6319e98 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M5-00 |
| filingDate | 2013-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_524c7799bdcf7e9219d01474552eed56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_196c395cd2cf5ca41977e108195e3ce8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fed9232d162f7217257751c6d69533c |
| publicationDate | 2014-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103540192-B |
| titleOfInvention | Ionic metal ink for ink-jet printing preparation of copper circuit graphs on printed board surface and its preparation method and printing method |
| abstract | The invention discloses an ionic metal ink for ink-jet printing preparation of a copper circuit graph on a printed board surface and its preparation method and printing method. The ionic metal ink is used for treatment on the printed board surface. The ionic metal ink solves the problem that the existing nano-copper conductive ink has poor stability, needs sintering aftertreatment and can be oxidized and agglomerated easily in the sintering. The preparation method of the ionic metal ink comprises that a bio-adhesive monomer, a metal salt, a metal complexing agent, deionized water and a pH buffering agent are mixed and undergo a reaction; the reaction products are added with a surface tension conditioning agent and a viscosity conditioning agent; and a pH value of the mixture is adjusted to 4-6. The printing method adopting the ionic metal ink comprises that the printed board surface is subjected to chemical degreasing and corona treatment; the ionic metal ink is spray-printed on the printed board surface to form circuit graphs composed of the ionic metal ink; the circuit graphs are dried at a low temperature; and the printed board surface with the circuit graphs is put into a chemical copper-plating solution for in-situ growth so that the copper circuit graphs are obtained. The printing method can be used for the technical field of printed electronics. |
| priorityDate | 2013-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 91.