http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103540151-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 |
filingDate | 2012-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2016-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-103540151-B |
titleOfInvention | For the modified resin composition of depositing metal films, its preparation method with and application |
abstract | The invention provides a kind of modified resin composition for depositing metal films, prepare the method for described modified resin composition and the application of this modified resin composition. Described modified resin composition comprises: resin matrix: 35-95wt%; Additive: 0-60wt%; Laser-sensitive additive: 5-12wt%; The chemical general formula of described laser-sensitive additive is XY 2 O 4 , isometric system, ginseng Figure of abstract, axial length a=b=c, shaft angle α=β=γ=90 °; X and Y are metallic element, from group IIIA, I B family, II B family, VI B family, VII B family or VIII family in the periodic table of elements; Laser-sensitive additive package contains metal oxide, and metal oxide accounts for the 0.01-10wt% of laser-sensitive additive. Modified resin composition of the present invention is under laser action, laser-sensitive additive has metallic particles to disengage, follow-up without in electrochemistry plating, metallic particles plays the effect of active centre, make the metal ion in chemical plating fluid deposit selectively, form metallic film, can be used for the product of surface mounting technology (SMT). |
priorityDate | 2012-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.