Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-35121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02379 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02317 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-301 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate |
2013-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-103489850-B |
titleOfInvention |
CTE adaption in a semiconductor package |
abstract |
The invention refers to a CTE adaption in a semiconductor package. A device such as a wafer-level package (WLP) device is proposed in which a dielectric layer is disposed between a surface of a semiconductor device and a surface of a redistribution layer (RDL). The dielectric layer may have at least one interconnect extending through the dielectric layer. The dielectric layer may have a coefficient of thermal expansion (CTE) value in a direction perpendicular to the surface of the semiconductor device that is less than a threshold value, and a Young's modulus that is greater than another threshold value. The dielectric layer may have a CTE value in a direction parallel to the surface of the semiconductor device at a surface of the dielectric layer facing the RDL that is greater than another threshold value. |
priorityDate |
2012-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |