| abstract |
The present invention relates to the adhesive bonding method of first contact surface (3) of the first substrate (1) and second contact surface (4) of the second substrate (2), described method has the following step, the most following process: form bank (5) in the surface layer (6) on the first contact surface (3), wherein surface layer (6) is at least mainly made up of native oxide material, bank (5) is at least partly filled with the first raw material thing or first group of raw material thing, the first contact surface (3) is made to contact with the second contact surface (4) to form pre-bonded connection, at the first and second contact surfaces (3, 4) permanent adhesive is formed between, it is at least partly strengthened by the reaction of the second raw material thing contained in the conversion zone (7) of the first raw material thing and the second substrate. |