http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103408896-B

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Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F9-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103408896-B
titleOfInvention A kind of epoxy resin composite material containing Nanometer Copper and preparation method thereof
abstract The invention discloses a kind of epoxy resin composite material containing Nanometer Copper and preparation method thereof, comprise the following steps: in reaction flask, add the presoma of copper, protective material, polyvalent alcohol, epoxy resin successively, be warming up to temperature of reaction, after in-situ heat reduction reaction, obtain Nanometer Copper/epoxy composite slurry; By the dispersion of this slurry in a solvent, after adding solidifying agent, under solidification value, solidification obtains nano-copper/epoxy resin composite material.The nano copper particle utilizing the method to obtain is uniformly dispersed in epoxy matrix; its size can be controlled between 50 ~ 250nm; massfraction can be controlled between 5% ~ 80%; by selecting suitable presoma, reductive agent and protective material; can make there is no impurity in the slurry prepared, there is good dispersion stabilization and oxidation stability in organic solvent simultaneously.This preparation method technique is simple, and production cost is low, can be used as buried capacitor dielectric material and is applied to Electronic Packaging field, is applicable to large-scale industrial production.
priorityDate 2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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