| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24975
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2038-0092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate |
2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a6606c52b032e92b11924f00632ea36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afa6a19ddc6754bb02118035c2d2b7f8 |
| publicationDate |
2013-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103392024-A |
| titleOfInvention |
Two-layered copper-clad laminate material, and method for producing same |
| abstract |
A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 [mu]m is formed by means of sputtering or plating on one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 [mu]m after a plasma treatment is performed in a nitrogen gas atmosphere, the two-layered copper-clad laminate material being characterized in that the dissolution of the aforementioned polyimide film due to an etching liquid is delayed compared with a polyimide film that is not subjected to the plasma treatment, the aforementioned dissolution being delayed as a consequence of reforming the surface of the polyimide film by including nitrogen into the polyimide film by means of the plasma treatment performed in the nitrogen gas atmosphere. The present invention address the problem of obtaining a two-layered copper-clad laminate material (plate) which exerts excellent adhesive properties and adhesive properties after thermal aging, and does not peel off when etching a polyimide dry film, at which point the dissolution properties of the polyimide film is delayed (the polyimide film does not dissolve) compared with a non-treated polyimide film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106350843-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106350843-B |
| priorityDate |
2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |