http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103376653-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2012-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103376653-B |
| titleOfInvention | Photosensitive water development welding resistance composition and photosensitive water development dry film solder mask |
| abstract | The present invention relates to a kind of photosensitive water development welding resistance composition, this photosensitive water development welding resistance composition is made up of the water of phthalic anhydride half ester modified phenolic epoxy acrylic acid fat, phenyl triphenol diacrylate fat and phthalic anhydride half ester, novalac epoxy SA monoesters, light trigger, colorant, plastifier, inorganic filler, levelling defoamer, coupling agent, emulsifying agent, polymerization inhibitor and surplus.Phthalic anhydride half ester modified phenolic epoxy acrylic acid fat it can provide water-soluble, water development, well film forming and contact drying, adhesion when making this photosensitive water development welding resistance composition be applied to printed-wiring board (PWB) welding resistance patterning is higher.The present invention also provides a kind of photosensitive water development dry film solder mask be made up of this photosensitive water development welding resistance composition. |
| priorityDate | 2012-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.