| abstract |
The invention provides the manufacture method of a kind of electronic device and manufacture method thereof, electronic equipment, basal substrate, the joint of can suppress to overflow from the heat of metal layer, can reliably carry out cap and basal substrate.Electronic device (100) has encapsulation (200) and is accommodated in the piezoelectric element (300) in the accommodation space (S) of the inside being formed at encapsulation (200).Have the metal layer 230 of the frame-shaped that basal substrate (210) and lid (220) are engaged and be formed in the upper electrode (241,242,251 ~ 254,261,262) be electrically connected with piezoelectric element (300) of basal substrate (210), metal layer (230) and each electrode (241,242,251 ~ 254,261,262) insulate. |