http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103361685-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 |
| filingDate | 2013-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103361685-B |
| titleOfInvention | Plating solution and electro-plating method |
| abstract | Plating solution and electro-plating method.The invention discloses the sn-ag alloy electroplate liquid containing specific amine oxide surfactant and the method using this plating solution to electroplate stanniferous silver layer.Above-mentioned electroplate liquid is for providing the tin-silver solder deposition of chip (die) the interior uniformity of hole formation rate and the improvement with reduction.Providing a kind of electroplating composition, described composition includes: water miscible divalent tin ion source；Water miscible source of silver ions；Water；Acid electrolyte；And alkoxylate oxide surfactant. |
| priorityDate | 2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 142.