http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103360972-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a963bc791608f663938bafe8454f40ba |
| publicationDate | 2015-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103360972-B |
| titleOfInvention | An adhesive tape for protecting the surface of a semiconductor chip |
| abstract | The invention provides an adhesive tape for protecting the surface of a semiconductor chip. The adhesive tape completely follows the recesses on the surface of the semiconductor chip when pasted on the surface of the semiconductor chip. It may reduce the generation of dimple of a grinding surface of the semiconductor chip and the damage of the semiconductor chip when the back of the semiconductor chip is grinded. The adhesive tape for protecting the surface of a semiconductor chip is characterized in that an adhesive layer formed by pressure-sensitive adhesive is disposed on a base material film, and that the adhesive layer follows the recesses when pasted on the chip with the recesses and has a shape fixed rate over 50 percent of the recesses. |
| priorityDate | 2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.