| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate |
2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103360963-B |
| titleOfInvention |
Joint fastener, electronic unit and manufacture method thereof |
| abstract |
The present invention relates to joint fastener, electronic unit and manufacture method thereof, described joint fastener possess on a face of solder layer and at least thickness direction that is layered in solder layer and containing thermosetting resin containing thermoset resin layer, described solder layer contains solder grain, thermoplastic resin and can activate the activating agent of solder grain. |
| priorityDate |
2012-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |