http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103347943-A

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filingDate 2012-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50aebe8bb68da8f858ddb17421506f90
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publicationDate 2013-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103347943-A
titleOfInvention Porous resin molding, porous substrate, and process for production of porous resin molding
abstract The purpose of the present invention is to provide: a porous resin molding which has excellent heat resistance, has a fine cellular structure, and has a low permittivity; a process for producing the porous resin molding; and a porous substrate which has a metal foil on one surface thereof and is extremely useful as a circuit board for an electronic device. The present invention provides a porous resin molding which has cells having an average cell diameter of 5 [mu]m or smaller, has a porosity of 40% or more, and has a relative permittivity of 2.00 or less at a frequency of 1 GHz.
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priorityDate 2011-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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