http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103342895-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-12 |
| filingDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103342895-B |
| titleOfInvention | A kind of compositions of thermosetting resin and the prepreg using it to make and veneer sheet |
| abstract | The invention discloses a kind of compositions of thermosetting resin, with solid weight meter, comprising: (a) allyl group modified bismaleimide resin prepolymer: 10 ~ 50 parts; (b) cyanate ester resin: 10 ~ 50 parts; (c) active ester: 10 ~ 50 parts.Compositions of thermosetting resin of the present invention overcomes in prior art the higher problem of the dielectric loss tangent value that adopts epoxy resin to bring, make resin system have high cohesive force and low specific inductivity simultaneously, high density interconnect unicircuit can be applied to better, base plate for packaging, high-frequency high-speed contour performance printed circuit board field. |
| priorityDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.