http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103342894-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103342894-B |
| titleOfInvention | Compositions of thermosetting resin and the prepreg using it to make and veneer sheet |
| abstract | The invention discloses a kind of compositions of thermosetting resin, with solid weight meter, comprising: (a) allyl group modified bismaleimide resin prepolymer: 10 ~ 60 parts; (b) cyanate ester resin: 10 ~ 50 parts; (c) active ester: 10 ~ 30 parts; (d) epoxy resin: 5 ~ 25 parts; (e) mineral filler: 0 ~ 35 part.The present invention devises a kind of new compositions of thermosetting resin, uses less mineral filler, can obtain higher rigidity and lower thermal expansivity, can while the high rigidity of maintenance, the dielectric properties of unlikely its excellence of loss again; Resin combination of the present invention can be applied to high density interconnect integrated antenna package and high-speed high frequency contour performance printed circuit board field better. |
| priorityDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.