http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103341701-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 |
| filingDate | 2013-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103341701-B |
| titleOfInvention | Soft soldering scaling powder |
| abstract | The formula of a kind of soft soldering scaling powder of the present invention, wherein add par molecular weight between 700 ~ 3000 polybutene, rosin and alkoxide interfacial agent; Wherein this polybutene weight ratio in scaling powder is less than 7%, or is less than the welding soldering flux of 15% relative to the weight ratio of rosin; Wherein this rosin be selected from Foral, newtrex, sour upgrading rosin one or more.Current pb-free solder still has scolding tin to cause diffusivity not enough because of high-temperature oxydation, and scaling powder residue is too much, hardening, causes circuit turn-on to test bad problem.The invention provides a kind of New Flux, in the process of high temperature reflow, there is heat endurance, and improve the not enough and circuit turn-on of diffusivity and test bad problem. |
| priorityDate | 2013-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 109.