http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103333663-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66bc9432f438141503131de4c85e615b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2013-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_793d93a7c99aecc9e0c71d95cfae7b42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ef2b3518cc79d581cae9c166a8f197d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3c12eec58633c6627d6a00c12fcb5ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ab868659f8dd7a18a6aa300384d3669 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bcd4767b4880b8b22b57b8d7e75419 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_497890df0efe0ee87d6476dd92f46a5c |
| publicationDate | 2014-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103333663-B |
| titleOfInvention | Rare earth polishing powder and preparation method thereof |
| abstract | The invention discloses a rare earth polishing powder and a preparation method thereof. The rare earth polishing powder is characterized by comprising the following ingredients in percentage by weight: 6-10% of silicon oxide, and 90-94% of a rare earth oxide. The rare earth polishing powder disclosed by the invention is free of fluorine which is easy to cause scratch, environment pollution and the like, so that the precision in polishing is ensured; through pretreatment on carbonic acid rare earth, specific crystal forms are obtained, and the existence of lanthanum in a solid solution manner is ensured; due to the introduction of silicon dioxide, the formation of lanthanum hydroxide in the polishing process is prevented. The rare earth polishing powder has the characteristics of high production efficiency, low cost, pollution freeness and high abrasion resistance and high polishing rate of the polishing powder, and is applicable to surface polishing machining on precise devices of the electronic information industry such as integrated circuits, flat displays and optical glass. |
| priorityDate | 2013-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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