http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103331968-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e2378c7f20ef1aab41b458994a54808 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B19-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 |
| filingDate | 2013-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8dc2c137dc3f363dda8d889f78c9d5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2aef0297ae69c7125edf018d70154d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52d984976dcfce49d1274fef14e027c1 |
| publicationDate | 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103331968-B |
| titleOfInvention | High thermal conductive fiberglass cloth base laminate |
| abstract | The invention discloses a high thermal conductive fiberglass cloth base laminate, which includes a bismaleimide substrate. One side or two sides of the bismaleimide substrate is provided with a thermal conductive coating. The thermal conductive coating comprises, from top to bottom, a metal coating layer, a DLC (diamond-like carbon) coating layer and a transition coating layer. The transition coating layer is arranged on the bismaleimide substrate. The invention designs a new high thermal conductive fiberglass cloth base laminate, which makes use of the high thermal conducting property of the DLC coating layer in the thermal conducting layers to make the heat generated by heat generating components on a circuit board spread rapidly in a substrate line plane, and makes use of the heat conductivity of the substrate to export the heat, thus reaching a good heat dissipating effect. Meanwhile, the substrate has excellent insulativity, heat resistance, high reliability, and excellent physical and mechanical properties. |
| priorityDate | 2013-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.