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filingDate 2009-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103325764-B
titleOfInvention Support the electrical interconnection die assemblies installed
abstract Stack chip assembly is electrically connected to the connecting portion in any support, and without being electrically connected to the substrate or the lead frame that insert, and without solder.
priorityDate 2008-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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