http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103325686-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5fbc18c46a10cad08eebce6b92615d08
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2013-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16466f2679786688a7adbb5baa35e918
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a148376aa283121b06c6bad5f33384fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_477222d604ba8b5531321cc1b8a0ce1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003a057f29fc8729783ac55b7cc4f36a
publicationDate 2015-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103325686-B
titleOfInvention Method for preparing diamond base FET device with T-similar-type grid shelter autocollimation technology
abstract The invention discloses a method for preparing a diamond base FET device with the T-similar-type grid shelter autocollimation technology, and relates to the technical field of methods for manufacturing semiconductor devices. The method comprises the step of forming a high-resisting diamond layer on a high temperature resistance substrate, the step of forming a conducting channel in the high-resisting diamond layer, the step of covering the surface of the high-resisting diamond layer with a metal mask layer, the step of photoetching a table-board, the step of removing a metal mask outside the table-board area through corrosive liquid, the step of forming grids on the metal mask in a photoetching mode, the step of removing the metal mask in the middle of a source leaking area through the corrosive liquid and forming source leakage, the step of manufacturing the T-similar-type grids in the corrosion area, the step of oxidizing or nitriding the outer sides of metal grids and forming a dielectric layer, and the step of enabling the T-similar-type grids to serve as a shield. According to the method, the T-similar-type grid shelter autocollimation technology is adopted, the distance between a grid source position and a grid leakage position is effectively shortened and is basically equal to the grid length, and the grid source resistance and grid leak resistance are reduced.
priorityDate 2013-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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