http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103311131-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 2013-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103311131-B |
| titleOfInvention | The method of micro convex point side direction undercutting is prevented in a kind of micro convex point manufacture process |
| abstract | The invention discloses a kind of formation method of micro convex point, comprising: s1, form pad on a semiconductor substrate; S2, form dielectric layer at pad and semiconductor substrate surface, described dielectric layer offers window, and described window is corresponding with pad; S3, form Seed Layer on the surface of dielectric layer and pad; S4, form micro convex point at described Seed Layer electroplating surface; S5, Seed Layer around micro convex point in certain distance form barrier layer; S6, etching be not by Seed Layer that barrier layer covers; S7, reflux solder.The present invention proposes by the Seed Layer around micro convex point covers one deck etching barrier layer, like this when carrying out Seed Layer etching, Seed Layer below it can be protected from etching, thus prevent the phenomenon of side direction undercutting.Improve reliability and the yields of micro convex point processing and manufacturing. |
| priorityDate | 2013-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.