http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103305820-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8c3bcc443e9cf4a1cda34337875ccde5 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate | 2013-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_854e7931167f5e8df993b8c6b5ed6111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_703a7b475c52e32b2267921c892c2656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cab36373bf763b0f2295226a0c4204b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21e6ecc9db228ff86da4f328e1090dc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f928e2ee7dea5cf42d8f8a1df17cd3da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7030b2cdfcc8da397ea59a604ccddb0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_311f0942b6101ff9db63b763240bbaf4 |
| publicationDate | 2015-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103305820-B |
| titleOfInvention | Plating solution for chemically plated bottom nickel and electroplated nickel of carbon fiber cyanate ester-based composite material, and plating method thereof |
| abstract | The invention provides a plating solution for chemically plated bottom nickel and electroplated nickel of a carbon fiber cyanate ester-based composite material, and a plating method. The invention provides a plating solution for chemically plated bottom nickel of carbon fiber-reinforced cyanate ester-based composite material, and a plating solution for electroplated nickel of the carbon fiber cyanate ester-based composite material, and a plating method of the plating solution for the chemically plated bottom nickel and electroplated nickel. Electroplated thick nickel layers with thickness up to about 400mu m can be obtained, and are good in binding force with a matrix, good in ductility and low in internal stress. The thick nickel layers obtained by adopting the method are uniform and compact, good in binding force together with the matrix, good in ductility and low in internal stress, and the whole technology is simple to operate, low in cost, good in stability and safe and reliable. |
| priorityDate | 2013-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.