http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103265791-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e2378c7f20ef1aab41b458994a54808 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 |
| filingDate | 2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24d6fde8cd38dcd29eea285320323fe5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8dc2c137dc3f363dda8d889f78c9d5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2aef0297ae69c7125edf018d70154d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db2a7180cbe93b9009aa958dd04a3ff5 |
| publicationDate | 2015-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103265791-B |
| titleOfInvention | Thermosetting resin composition for integrated circuit as well as prepreg and laminated board both fabricated by using composition |
| abstract | The invention discloses a thermosetting resin composition for an integrated circuit. The thermosetting resin composition comprises (a) 10-60 parts of an allyl modified bismaleimide resin prepolymer, (b) 10-40 parts of an anhydride compound, (c) 10-50 parts of benzoxazine resin, (d) 5-50 parts of epoxy resin, (e) 5-50 parts of a fire retardant, (f) 0-5 parts of a curing accelerator and (g) 0-35 parts of inorganic stuffing, wherein the number-average molecular weight of the allyl modified bismaleimide resin prepolymer is 1500-8000 g/mol. The resin composition provided by the invention keeps high heat resistance and high Tg characteristic of the allyl modified bismaleimide resin prepolymer, and achieves UL94V-0 level in halogen-free flame retardant aspect on the basis of low phosphorus content, and simultaneously, has low dielectric constant of the anhydride; and therefore, the resin composition is capable of meeting the requirements of the production process of high-performance printed circuit boards such as a high-density interconnected integrated circuit package. |
| priorityDate | 2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 84.