http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103257534-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81ca9a5f1da06521982d5a6b55b04244
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
filingDate 2013-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6462ed25f469a1096606b411572d89e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_083e559db531e343628fe837b2abfee3
publicationDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103257534-B
titleOfInvention Photoetching rework photoresist removing technology
abstract The invention discloses a photoetching rework photoresist removing technology which comprises the steps of: providing a wafer to be treated by photoetching rework; photoetching the surface of the wafer for a first time to produce residual photoresist; using a photoetching machine which can generate a light beam capable of enabling the photoresist to be in complete photochemical reaction to expose the surface of the whole wafer; and developing the surface of the exposed wafer, and removing the photoresist. According to the technology, plasma dry ashing does not need to be utilized, high-temperature manufacture procedure does not exist, and chemical liquid with strong oxidizing property or acidity is not needed, so that a film on the surface of the wafer is not damaged or modified. The technology is simple and less in material consumption, improves the stability and the manufacturing performance of the whole manufacturing process flow, and adds the limitation for the maximum photoetching rework times, thus providing high technical fault tolerance for research, development and mass production.
priorityDate 2013-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101281379-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419513958
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449779615
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21910289
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3776
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453615033
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID60966

Total number of triples: 20.