Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a16f72268f5a1eb4f08073323a474668 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49586 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49558 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
filingDate |
2013-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b86b8e26a6fd18f3c4c6c1e708d3fed |
publicationDate |
2013-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-103247539-A |
titleOfInvention |
Method of preventing epoxy bleed out of lead frame and lead frame manufactured by using the same |
abstract |
The invention discloses a method of preventing epoxy bleed out of lead frame and a lead frame manufactured by using the same. The method includes: providing a lead frame that is manufactured through a shaping process which forms a die pad and a plurality of leads by using a conductive raw material, a pre-plating process performed on the shaped conductive raw material, and a tape attaching process; and performing a bleed out prevention process which prevents an epoxy bleed out of a die bonding epoxy-based resin applied on the die pad after the tape attaching process. |
priorityDate |
2012-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |