http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103242775-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59ef02e898c8bb1b51813b6d93434027 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-14 |
| filingDate | 2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1916aa115ad9e1c75570f509697ff3a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_574e03acdb049e846fa9c7a77939ab7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffc1fe27989108842d8a40a2d22a3956 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c453e51875313ac2d5b5e94a8cd1ca39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e575aaf0eb88e0c50cb359487b5a8364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b403f0ab9ad961803303c1e497eba91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0596fb290581bf07eca6d99cd96c416d |
| publicationDate | 2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-103242775-B |
| titleOfInvention | Acrylic ester modified epoxy resin conductive chip adhesive |
| abstract | The invention relates to an acrylic ester modified epoxy resin conductive chip adhesive and belongs to the technical field of adhesives applied to microelectronic packaging. The conductive chip adhesive consists of sheet-like silver powder, epoxy resin, acrylic ester modified epoxy resin, a curing agent, a coupling agent and a diluent, wherein the acrylic ester modified epoxy resin is a copolymerization product of glycidyl methacrylate and 2 to 3 types of acrylic ester monomers and/or olefin monomers; the coupling agent comprises a silane coupling agent KH-550 and the like; and the diluent is 1,4-butanediol diglycidyl ether. The acrylic ester modified epoxy resin conductive chip adhesive has the effects that the high temperature resistance, high humidity resistance and ageing resistance of the epoxy resin are improved; the volume resistivity is low; the bonding strength is high; the conductive chip adhesive is adapted to the electronic packaging requirement of lead-free, high-temperature and high-humidity environments; the packaging reliability is improved; and the service life of packaged devices is prolonged. |
| priorityDate | 2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.