http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103242768-B

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publicationDate 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-103242768-B
titleOfInvention High-tenacity bismaleimide resin carrier structure adhesive film and preparation method thereof
abstract The invention relates to a high-tenacity bismaleimide resin carrier structure adhesive film and a preparation method thereof. The invention aims at solving the problems of the existing bismaleimide adhesive that the tenacity is poor and the peel strength is low. The adhesive film is prepared from bismaleimide resin, a technical modifier, macromolecule blending alloy, a curing agent, a silane coupling agent and a carrier. The preparation method of the adhesive comprises the following steps of: firstly pre-polymerizing the bismaleimide resin and the copolymeric modifier so as to prepare bismaleimide resin prepolymer, then uniformly mixing the bismaleimide resin prepolymer, the macromolecule blending alloy, the silane coupling agent and the curing agent so as to prepare sizing material through a mechanical blending method, and taking braided fabric as the carrier and preparing the film adhesive through a dual-roller hot rolling manner. The adhesive has the characteristics of high strength, thermostability and high tenacity and can be used for cementing thermostability metal and resin-based compound material structural members in the field of aerospace.
priorityDate 2013-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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